Investigation of Si wafer Damage in manufacturing processes

SIDAM is a European Commission project under the SEVENTH FRAMEWORK PROGRAMME ICT-1-3.1 : Next generation nanoelectronics components and electronics integration. The project gathers partners from different European countries: Jordan Valley Semiconductors Ltd.(United Kingdom), the Universities of Durham (United Kingdom), Dublin City (Ireland), Freiburg (Germany), CEIT San Sebastian (Spain), and the ANKA synchrotron, Karlsruhe (Germany).

Coordinator: Prof. Brian Tanner, University of Durham

Scientific Committee Chair: Prof. Keith Bowen, University of Durham.

The aim of the project is to discover how to derive quantitative, predictive information from X-ray Diffraction Imaging (XRDI), enabling a breakthrough metrology of wafer inspection. The outcome of this research will offer a competitive advantage at several levels to those members of the European Semiconductor Industry who agree to join the Industrial Advisory Board. European wafer manufacturers will have early access to a technique that reveals the nature of the defects in the wafers and their relevance to semiconductor device fabrication.

More details about the project can be found in the Project Overview page.


Requests or questions can be sent to the project members in the Contact page.