Investigation of Si wafer
Damage in manufacturing processes
SIDAM is a European Commission project under the SEVENTH FRAMEWORK PROGRAMME ICT-1-3.1
: Next generation nanoelectronics components and electronics integration. The project
gathers partners from different European countries: Jordan Valley Semiconductors
Ltd.(United Kingdom), the Universities of Durham (United Kingdom), Dublin City (Ireland),
Freiburg (Germany), CEIT San Sebastian (Spain), and the ANKA synchrotron, Karlsruhe
Prof. Brian Tanner, University of Durham
Scientific Committee Chair:
Prof. Keith Bowen, University of Durham.
The aim of the project is to discover how to derive quantitative, predictive information
from X-ray Diffraction Imaging (XRDI), enabling a breakthrough metrology of wafer
inspection. The outcome of this research will offer a competitive advantage at several
levels to those members of the European Semiconductor Industry who agree to join
the Industrial Advisory Board. European wafer manufacturers will have early access
to a technique that reveals the nature of the defects in the wafers and their relevance
to semiconductor device fabrication.
More details about the project can be found in the Project
Requests or questions can be sent to the project members in the Contact page.